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FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

ShenZhen Jieteng Circuit Co., Ltd.
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    Buy cheap FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process from wholesalers
     
    Buy cheap FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process from wholesalers
    • Buy cheap FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process from wholesalers

    FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

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    Brand Name : JIETENG
    Model Number : FR4
    Certification : ISO/TS16949/RoHS/TS16949
    Price : Negotiable
    Payment Terms : Negotiable
    Supply Ability : 150000 square meters / year
    Delivery Time : 5-8 working day
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    FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

    FR4 TG180 multilayer printed circuit board immersion gold process


    FR4 TG180 is a special type of substrate material used in the manufacture of printed circuit boards (PCBs). It has a glass transition temperature (Tg) of 180°C, indicating that it can withstand high temperatures during operation without losing its mechanical or electrical properties. A multilayer PCB made with FR4 TG180 material refers to a PCB with more than two layers, usually 4 to 16 layers or more. The exact features and specifications of a multilayer FR4 TG180 PCB will depend on the manufacturer, but some common features may include:

    Multilayer Count: Multilayer FR4 TG180 PCBs typically have more layers than single or two-layer PCBs, adding functionality and complexity.

    High Heat Resistance: FR4 TG180 material has high heat resistance and is suitable for high temperature applications.

    Tighter impedance control: Multilayer FR4 TG180 PCBs can have tighter impedance control, which is especially important for high-speed digital and RF applications.

    High-frequency performance: FR4 TG180 material has good high-frequency performance and is suitable for occasions requiring high-speed signal transmission.

    Smaller via sizes: Multilayer FR4 TG180 PCBs can use smaller via sizes, increasing density and reducing signal interference.

    Overall, the multilayer FR4 TG180 PCB is a high performance PCB suitable for a wide range of applications where high temperature, high speed signal transmission and impedance control are important.


    PCB LayerMultilayer Printed Circuit board(12L)
    PCB surface finishedImmersion gold 2u" (0.05 - 0.1 µm gold over 3 - 5 µm of Nickel.) and gold finger
    PCB material requirementFR4, TG180
    PCB thickness finished2.2mm finished, +/-10%
    Smallest hole size0.20mm
    PCB solder resist2 sides, blue
    PCB silkscreen color2 sides, white
    Copper weigh of outer layer1 oz (35µm) Finished Copper Weight
    Copper weigh of inner layer1/2 oz (18µm) Base Weight
    Special requirementsCopper filled vias and supplied stack-up

    Shenzhen Jieteng Circuit Co., Ltd.

    Professional rapid proofing and multi-variety batch expedited PCB circuit boards

    FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process

    Quality FR4 TG180 Multilayer Printed Circuit Board Immersion Gold Process for sale
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