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Multilayer Rigid Flex 6 Layer Prototype PCB Assembly Fabrication

ShenZhen Jieteng Circuit Co., Ltd.
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    Buy cheap Multilayer Rigid Flex 6 Layer Prototype PCB Assembly Fabrication from wholesalers
     
    Buy cheap Multilayer Rigid Flex 6 Layer Prototype PCB Assembly Fabrication from wholesalers
    • Buy cheap Multilayer Rigid Flex 6 Layer Prototype PCB Assembly Fabrication from wholesalers

    Multilayer Rigid Flex 6 Layer Prototype PCB Assembly Fabrication

    Ask Lasest Price
    Brand Name : JIETENG
    Model Number : Rogers FR4
    Certification : ISO/TS16949/RoHS/TS16949
    Price : Negotiable
    Payment Terms : Negotiable
    Supply Ability : 150000 Square Meter/Square Meters per Year
    Delivery Time : 5-8 days delivery
    • Product Details
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    Multilayer Rigid Flex 6 Layer Prototype PCB Assembly Fabrication

    Scanner Board Military Board resin plug hole PCB Prototype PCB Assembly

    Essential details
    Type:
    Multilayer pcb
    Place of Origin:
    Guangdong, China
    Copper Thickness:
    0.5 OZ to 8 OZ
    Board Thickness:
    0.20mm to 3.4mm
    Min. Hole Size:
    0.2mm
    Min. Line Width:
    3mil
    Min. Line Spacing:
    3mil
    Surface Finishing:
    HASL/HASL lead free,HAL,Chemical tin, HASL/HASL lead free,HAL,Chemical tin,Chemical Gold
    Product name:
    multilayer circuit boards pcb pcba
    Material:
    FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX
    Layer
    1 to 60 layers
    Material Type
    FR-4. CEM-3. High TG. FR4 Halogen Free, RIGID-FLEX
    Board Thickness
    0.20mm to 3.4mm
    Copper Thickness
    0.5 OZ to 6 OZ
    Copper Thickness in Hole
    >25.0 um(>1mi)
    Max Size of Finish Board
    700*460mm
    Min.Drilled Hole Size
    1.0mm
    Min.Line Width
    3mil
    Min.Line Spacing
    3mil
    Surface finishing
    HASL/HASL lead free,HAL,Chemical tin,Chemical Gold,
    Immersion Silver/Gold,OSP,Gold plating
    Solder Mask Color
    Green/Yellow/Black/White/Red/Blue
    Shape tolerance
    ±4mil
    Hole tolerance
    PTH:±3mil,NPTH:±2mil
    Package
    Inner paking/Plastic bag,Outer packing:Standard
    carton packing
    Certificate
    UL,SGS, ISO 9001:2008,IATF16949
    Special requirements
    Buried and blind vias+controlled impedance+BGA
    Profiling
    Punching,Routing, V-CUT,Beveling

    Multilayer Rigid Flex 6 Layer Prototype PCB Assembly Fabrication







    Quality Multilayer Rigid Flex 6 Layer Prototype PCB Assembly Fabrication for sale
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